Flexible Electronics News

ASSA ABLOY, HID, NXP, Samsung, Bosch, Sony, LitePoint and TTA Establish FiRa Consortium

Goal is to drive seamless user experiences using ultra-wideband technology.

Author Image

By: DAVID SAVASTANO

Editor, Ink World Magazine

Recognizing the need for emerging applications to build on a strong foundation that supports interoperability among all categories of devices, four sponsor members – The ASSA ABLOY Group, HID Global, NXP Semiconductors, Samsung Electronics, and Bosch – announced the launch of the FiRa Consortium. The new coalition is designed to grow the Ultra-Wideband (UWB) ecosystem so new use cases for fine ranging capabilities can thrive, ultimately setting a new standard in seamless user experiences.    S...

Continue reading this story and get 24/7 access to Ink World magazine for FREE


Already a subscriber? Sign in

Keep Up With Our Content. Subscribe To Ink World magazine Newsletters